It is a machine that performs the cutting process of wafer blocks, which are turned into blocks after applying cream and then cooled, in specified dimensions.
Suitable for precise and high capacity cutting operations.
For the cutting process, the blocks first pass through the 1st cutting cage and then they are pushed into the 2nd cutting cage at right angles.
Cutting cages are designed to be easily changed when product dimensions are required.
Thanks to the automatic product feeding system located at the machine entrance, the wafer production process continues without human intervention.
The area where the wafer is cut is covered with a transparent polycarbonate cover.
Depending on the final cutting dimensions, the amount of waste generated during the cutting process is maximum 5%.
This corresponds to a shortening of the wafer block by approximately 5 mm from each edge.
The cut wafers are automatically fed to the separator or conveyor belt.
